Taiwan Chip-based Industrial Innovation Program

what
  1. IC DESIGN INNOVATIONS: Teams with proprietary IC design technology and core IP, planning and developing innovation.
  2. CHIP-BASED INNOVATIVE APPLICATIONS: Teams with domain knowledge in various industries and planning to combine to existing chip technologies for implementation for: Smart Data & Security, Smart Medtech, Smart Mobility, Sustainability, Smart Manufacturing


how

IC design grand challenge is part of the phase I implementation of Taiwan Chip-based Industrial Innovation Program, which is launched Feb 2024, with US$9.3 billion incentives for 10 years IC and AI development (2024-2033).

The focus areas are: Integrate generative AI with silicon chips to drive innovation, improve domestic talent cultivation and attract global R&D professionals, Accelerate adoption of heterogeneous integration and other advanced innovation technologies, Harness Taiwan's "silicon island" strengths to attract international startups and investment

Timeline for IC design grand challenge:

  1. May 14th, call launched
  2. Jun 30th, first round application deadline
  3. Sep 4-7th SEMICON TAIWAN
  4. Oct 17-19th TIE EXPO
  5. Jan 31st, 2nd round application deadline

Two rounds of application. Participants can apply online anytime.

Application will be initially reviewed. Candidates will be notified based on the results if they proceed to secondary review.

Secondary review consists of a 20-minute online presentation and Q&A.

Results will be announced two weeks after review, based on application volume.

call to action

Contact Martin.Vercouter@business-sweden.se to learn more.